JPS5143722Y2 - - Google Patents
Info
- Publication number
- JPS5143722Y2 JPS5143722Y2 JP9354171U JP9354171U JPS5143722Y2 JP S5143722 Y2 JPS5143722 Y2 JP S5143722Y2 JP 9354171 U JP9354171 U JP 9354171U JP 9354171 U JP9354171 U JP 9354171U JP S5143722 Y2 JPS5143722 Y2 JP S5143722Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9354171U JPS5143722Y2 (en]) | 1971-10-11 | 1971-10-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9354171U JPS5143722Y2 (en]) | 1971-10-11 | 1971-10-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4849951U JPS4849951U (en]) | 1973-06-30 |
| JPS5143722Y2 true JPS5143722Y2 (en]) | 1976-10-23 |
Family
ID=28006997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9354171U Expired JPS5143722Y2 (en]) | 1971-10-11 | 1971-10-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5143722Y2 (en]) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5730301B2 (en]) * | 1974-05-24 | 1982-06-28 | ||
| JPS5910075B2 (ja) * | 1973-09-19 | 1984-03-06 | 日本電気株式会社 | 電界効果型トランジスタ |
| JPS5929377Y2 (ja) * | 1975-03-07 | 1984-08-23 | 日本電気株式会社 | 高周波高出力トランジスタ装置 |
-
1971
- 1971-10-11 JP JP9354171U patent/JPS5143722Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4849951U (en]) | 1973-06-30 |